Japan, Jan. 28 -- SAMSUNG ELECTRONICS CO LTD has got intellectual property rights for 'IMAGE SENSING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME.' Other related details are as follows: Applica... Read More
Japan, Jan. 28 -- SUZUKI MOTOR CORP has got intellectual property rights for 'HYBRID VEHICLE MOTOR ASSIST CONTROL DEVICE.' Other related details are as follows: Application Number: JP,2020-102261 Ca... Read More
Japan, Jan. 28 -- ALPSALPINE CO LTD has got intellectual property rights for 'DISPLAY SYSTEM.' Other related details are as follows: Application Number: JP,2020-099253 Category (FI): G09G5/37,320,G0... Read More
Japan, Jan. 28 -- SHIMIZU CORP has got intellectual property rights for 'COLUMN-BEAM JOINT STRUCTURE.' Other related details are as follows: Application Number: JP,2020-098557 Category (FI): E04B1/3... Read More
Japan, Jan. 28 -- TAIHEIYO MATERIAL KK has got intellectual property rights for 'QUICK-HARDENING MORTAR COMPOSITION FOR SLOPE SURFACE CONSTRUCTION AND QUICK-HARDENING MORTAR FOR SLOPE SURFACE CONSTRUC... Read More
Japan, Jan. 28 -- GENERAL ELECTRIC CO has got intellectual property rights for 'DAMPING COATING COMPRISING CONSTRAINING LAYER.' Other related details are as follows: Application Number: JP,2021-0217... Read More
Japan, Jan. 28 -- NIPRO CORP has got intellectual property rights for 'SYRINGE PUMP.' Other related details are as follows: Application Number: JP,2020-074914 Category (FI): A61M5/145,500 Stage: Gr... Read More
Japan, Jan. 28 -- SCHOTT AG has got intellectual property rights for 'MOLTEN GLASS AND USE THEREOF.' Other related details are as follows: Application Number: JP,2021-057878 Category (FI): C03C3/091... Read More
Japan, Jan. 28 -- ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC has got intellectual property rights for 'CMP POLISHING PAD WITH POLISHING ELEMENTS ON SUPPORTS.' Other related details are as follo... Read More
Japan, Jan. 28 -- CANON INC has got intellectual property rights for 'SYSTEM, INTEGRATED MANAGEMENT DEVICE, AND EDGE DEVICE.' Other related details are as follows: Application Number: JP,2021-008444 ... Read More